1
|
SQSTSIS0226887
|
EXPOXY MOLDING COMPOUND (NON HAZARDOUS)
|
COOKSON SEMICONDUCTOR PACKAGING C/O
|
COOKSON SEMICONDUCTOR PACKAGING
|
2010-05-26
|
Singapore
|
5740 Kgs
|
395 CTN
|
2
|
SQSTSIS0224070
|
EPOXY MOLDING COMPOUND (NON HAZARDOUS)
|
COOKSON SEMICONDUCTOR PACKAGING C/O
|
COOKSON SEMICONDUCTOR PACKAGING
|
2010-04-08
|
Singapore
|
9322 Kgs
|
608 PK
|
3
|
SQSTSIS0197881
|
EPOXY MOLDING COMPOUND (NON HAZARDOUS)
|
COOKSON SEMICONDUCTOR PACKAGING C/O
|
COOKSON SEMICONDUCTOR PACKAGING
|
2008-11-29
|
Singapore
|
10500 Kgs
|
720 CTN
|
4
|
SQSTSIS0198024
|
EPOXY MOLDING COMPOUND/MOLD CLEANING COMPOUND
|
COOKSON SEMICONDUCTOR PACKAGING C/O
|
COOKSON SEMICONDUCTOR PACKAGING
|
2008-11-29
|
Singapore
|
5000 Kgs
|
396 CTN
|
5
|
SQSTSIS0194230
|
EPOXY MOLDING COMPOUND/TEMPERATURE RECORDERS
|
COOKSON SEMICONDUCTOR PACKAGING C/O
|
COOKSON SEMICONDUCTOR PACKAGING
|
2008-09-28
|
Singapore
|
8120 Kgs
|
540 CTN
|
6
|
SQSTSIS0194484
|
EPOXY MOLDING COMPOUND (NON HAZARDOUS)
|
COOKSON SEMICONDUCTOR PACKAGING C/O
|
COOKSON SEMICONDUCTOR PACKAGING
|
2008-09-28
|
Singapore
|
2220 Kgs
|
153 CTN
|
7
|
SQSTSIS0192307
|
EPOXY MOLDING COMPOUND/TEMPERATURE RECORDERS
|
COOKSON SEMICONDUCTOR PACKAGING C/O
|
COOKSON SEMICONDUCTOR PACKAGING
|
2008-08-24
|
Singapore
|
10290 Kgs
|
684 CTN
|
8
|
SQSTSIS0192546
|
EPOXY MOLDING COMPOUND (NON HAZARDOUS)
|
COOKSON SEMICONDUCTOR PACKAGING C/O
|
COOKSON SEMICONDUCTOR PACKAGING
|
2008-08-24
|
Singapore
|
200 Kgs
|
12 CTN
|
9
|
SQSTSIS0191438
|
EPOXY MOLDING COMPOUND/TEMPERATURE RECORDERS
|
COOKSON SEMICONDUCTOR PACKAGING C/O
|
COOKSON SEMICONDUCTOR PACKAGING
|
2008-08-09
|
Singapore
|
5960 Kgs
|
396 CTN
|
10
|
SQSTSIS0191694
|
EPOXY MOLDING COMPOUND & MOLD CLEANING
|
COOKSON SEMICONDUCTOR PACKAGING C/O
|
COOKSON SEMICONDUCTOR PACKAGING
|
2008-08-09
|
Singapore
|
3890 Kgs
|
256 PK
|