1
|
EMLTHKGS00254194
|
COMPUTER PARTS (HEAT SINK)
|
TRANS EXPEDITE INC
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-08-26
|
Hong Kong
|
640 Kgs
|
79 CTN
|
2
|
AGWTSHK201037403
|
HEAT SINK
|
FORTINET, INC.
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP.
|
2025-08-25
|
China
|
262 Kgs
|
50 CTN
|
3
|
DFDSHKG1341403
|
HEAT SINK USE FOR ELECTRONICAL
|
HARMAN PROFESSIONAL, INC. C-O JD GR
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-08-25
|
China Taiwan
|
171 Kgs
|
11 CTN
|
4
|
EMLTHKGS00249413
|
HEAT SINK
|
CLOUD NETWORK TECHNOLOGY SINGAPORE
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-08-18
|
Hong Kong
|
1458 Kgs
|
334 CTN
|
5
|
EMLTHKGS00248339
|
HEAT SINK
|
CLOUD NETWORK TECHNOLOGY SINGAPORE
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-08-18
|
Hong Kong
|
468 Kgs
|
68 CTN
|
6
|
RRKKF5070144
|
THERMAL MODULE
|
QCH, INC., A NEVADA CORPORATION
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP.
|
2025-08-13
|
China
|
2473 Kgs
|
303 CTN
|
7
|
EMLTHKGS00246660
|
HEAT SINK
|
CLOUD NETWORK TECHNOLOGY SINGAPORE
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-08-12
|
Hong Kong
|
1090 Kgs
|
168 CTN
|
8
|
EMLTHKGS00245590
|
HEAT SINK
|
CLOUD NETWORK TECHNOLOGY SINGAPORE
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-08-12
|
Hong Kong
|
91 Kgs
|
18 CTN
|
9
|
EXDO6911623882
|
HEATSINK FOR ELECTRONICS HTS: 854442
|
CLOUD NETWORK TECHNOLOGY USA INC
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-08-12
|
Hong Kong
|
470 Kgs
|
42 CTN
|
10
|
FCIFL25706218LAX
|
THERMAL MODULE HS 8473305100
|
QCHINC
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-08-08
|
China
|
213 Kgs
|
23 CTN
|